PCB Electrolytic Copper Foil Standard profile (S) high temperature ductile (HTE) copper foil characteristics:
Classification | Unit | 9μm | 12μm | 18μm | 35μm | ||||||||||||||
Cu Content | % | ≥99.8 | |||||||||||||||||
Area weigh | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | ||||||||||||
Tensile Strength | R.T.(25℃) | Kg/mm2 | ≥28 | ≥30 | |||||||||||||||
H.T.(180℃) | ≥15 | ||||||||||||||||||
Elongation | R.T.(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | |||||||||||||
H.T.(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | ||||||||||||||||
Roughness | Shiny(Ra) | μm | ≤0.4 | ||||||||||||||||
Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | |||||||||||||
Peel Strength | R.T.(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 | |||||||||||
Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤5.0 | |||||||||||||||||
Change of color(E-1.0hr/200℃) | % | Good | |||||||||||||||||
Solder Floating 290℃ | Sec. | ≥20 | |||||||||||||||||
Pinhole | EA | Zero | |||||||||||||||||
Base material | --- | FR-4 | |||||||||||||||||
Note:
1. The Rz value of copper foils is the test stability value.
2. The stripping strength is the standard fr-4 test value (5 pieces 7628PP).
3. The quality guarantee period is 90 days from the date of receipt of the goods.
The company can provide the nominal thickness of 9-35um different width of FPC special copper foil.
PCB Electrolytic Copper Foil Characteristics:
The product has excellent room temperature storage performance and high temperature oxidation resistance, and the product quality reaches ipc-4562 standard.
PCB Electrolytic Copper Foil Application:
Suitable for all kinds of resin system of double-sided, multi-layer printed circuit board.
Advantage of PCB Electrolytic Copper Foil Application
The product adopts special surface treatment technology to improve the corrosion resistance of the product and reduce the risk of residual copper..
1. Standard Exporting package.
2. Original package or neutral package.
3. According to clients ' needs.
4. Shipped in10-35 days after payment.
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