Product Name | copper nickel silicon strip |
Thickness | 0.1-3.0mm |
Grade | copper alloy |
Cu (Min) | 94.3 |
Hardness | O-H112 |
Alloy Or Not | alloy |
SGS | ISO9001 |
Articles | Chemical composition | ||||||
GB | UNS | EN | JIS | Cu% | Ni% | Si% | Mg% |
- | C70250 | CuNi3SiMg | C7025 | Rem | 2.2-4.2 | 0.25-1.2 | 0.05-0.30 |
physical properties | fabrication properties | ||||||||
density g/cm3 | electrical conductivity %IACS | thermal conductivity W/(m.K) | modulus of elasticity GPa | specific heat J/(g.K) | cold-workability | machinability | electric plating property | hot dip tin plating property | weldability |
8.82 | 45 | 180 | 131 | 0.33 | good | less suitable | good | good | good |
Mechanical properties | |||||
Status | hardness (HV) | Tension test | |||
thickness(mm) | tensile strength(MPa) | yield strength MPa | elongation % | ||
TR02 | 180-220 | 0.1-3.0 | 607-726 | ≥550 | ≥6 |
TM02 | 190-240 | 650-740 | ≥585 | ≥10 | |
TM03 | 200-250 | 680-760 | ≥655 | ≥5 | |
TM04 | 225-275 | 750-840 | ≥740 | ≥1 | |
TM04S | 210-260 | 710-830 | ≥700 | ≥1 | |
copper nickel silicon strip Application:
Lead frames in large-scale IC, Connectors, Springs in relays.
1. Standard Exporting package.
2. Original package or neutral package.
3. According to clients ' needs.
4. Shipped in10-35 days after payment.
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