Grade Chart | |||||
China | International Standard | United States | Japan | United Kingdom | Germany |
T2 | Cu-RTP | C11000 | C1100 | C101 | R-Cu57 |
T2 Pure Copper Plate Chemical Composition | |||||||||||||
Alloy | Cu+Ag | P | Ag | Bi | Sb | As | Fe | Ni | Pb | Sn | S | Zn | O |
T2 | 99.9 | 0.001 | 0.002 | 0.002 | 0.005 | 0.005 | 0.005 |
T2 Pure Copper Plate Mechanical Properties | |||||||
Alloy | State | Tensile Test | Hardness Test | ||||
Thickness/mm | Tensile | Percentage Elongation After | Thickness/mm | HV | HRB | ||
T2 | R | 0.4-14 | ≥195 | ≥30 |
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M | 0.3-10 | ≥205 | ≥30 | ≥0.3 | ≤7 |
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T2 Pure Copper Plate Characteristics:
T2 Pure Copper Plate has good conduction, thermal conductivity, corrosion resistance and processing properties, soldering and brazing. Containing lower conductive, thermal conductivity less impurities, trace amounts of oxygen to the conductive, thermal conductivity and processing performance impact is not big, but easy cause hydrogen "disease", is not easy in the high temperature (> 370 ℃) processing, (welding, annealing, etc) in reducing atmosphere and use.
T2 Pure Copper Plate used for conducting, heat conducting and corrosion resistant equipment. For example: wire, cable, conductive screw, blasting detonator, chemical evaporator, storage device and various pipelines.
1. Standard Exporting package.
2. Original package or neutral package.
3. According to clients ' needs.
4. Shipped in10-35 days after payment.
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